RENA Technologies, North America

RENA Wafer Etching Technology

FluidJet™ Metal Lift-Off Processing

RENA’s Patented Fluidjet™ Metal Lift-Off Processing technology (Patent No. 9,070,631) provides metal removal utilizing precise hydraulic forces with unique robot agitation to maximize coverage resulting in a reliable performance with increased throughput, increased reclaim, and a reduction in chemical usage.

Features and Benefits:

  • Batch Immersion Processing eliminates spray control issues
  • Patented Process
  • Field-proven Process
  • Lower cost of ownership than a single wafer
  • Higher throughput than Single Wafer processing
  • No scratching or lifting on gate layers
  • Solvent Use Avg < = 40ml / Wafer Processed
  • Reduced Scrap
  • Auto-clean post-process to maximize uptime
  • Reduced footprint
  • Increased recovery/reclaim with integrated filters/screens
  • OTS equipment reduces downtime and CoO


  • Advanced monitoring and Control with IDX Flexware
  • Patent Pending ISODry Technology Maintains SW POR
  • Ultrasonic or Megasonic Available
  • Fluid and air handling flow modeling
  • Qualified and tested at the factory
  • Reduced Damage
  • Improved Lift-Off performance
  • No metal redeposition
  • Fewer suspended particles
  • Eliminates feature erosion and scratches
  • 80% Reduction in Chemical Use
  • Metal Reclaim > 99%
  • Lower cost of ownership
  • Batch immersion eliminates spray control issues
  • Increased Reclaim


  • 99% precious metal capture with integrated filters and screens
  • Accessible and removable screens provide rapid cleanouts
  • 50% Smaller Footprint
  • Efficient fab utilization
  • Easy installation and facilities hook up
  • Higher Reliability
  • Lower PM requirements
  • No spray nozzle changes
  • Reduced scrap
  • No complex wafer handling
  • No backside redeposit
  • 100 WPH Throughput
  • High uptime
  • 98% Tool Availability with No Robot Handling Errors
  • No daily shutdown for maintenance
RENA FluidJet™ Wafer Metal Lift-Off

Solving Key Metal Lift-Off Issues

  • Low Throughput –  Immersion and Single Chamber Single wafer tools are much slower requiring multiple tools for production needs
  • Scrap Due To Handling – Operators handling wafers to inspect, manually peal or spray off re-deposited metal, Robot transfer arm drift
  • Re-deposition Of Metal – Tanks & Chambers leave metal pieces in suspension in the soak/strip process causing subsequent focus errors in photo and yield loss/shorts
  • Device Damage – Scratching due to metal debris in suspension or being stripped across the wafer contacting devices at relatively high speed and force
  • Equipment Cost – Single wafer tools cost more than $1.5 million for comparable WPH
  • Solvent Usage – High consumption of solvent 1.5 –2.3 L/wafer w/spray @ 1200-1800 PSI Precious Metal Loss – Due to chamber rinse cycles (drain manifold), messy cleanouts (Glitter)
  • High Level Of PM Requirements – Regular metal cleanouts are required to avoid drain valve or filter clogs and flow system component damage due to excessive PM requirements, messy chamber cleanouts, nozzle replacements, robot arm drift realignment with single wafer tools

Contact our Experts

We are happy to help our customers find efficient and process-optimized solutions for their wet processing applications.