Wafer Drying Utilizing Advanced Hardware, Process Understanding & Software Execution
Wafer drying is completed while minimizing contact to production wafers. The Genesis utilizes a proprietary design to ensure the face of the wafer is not contacting the Teflon cassette during the dry cycle.
Improve Yield, Reduce Particles MEI’s integrated Marangoni Dryer provides superior performance by utilizing:
VARYING DRYER DESIGNS MATCH VARYING NEEDS
Integrated DI water filtration option
Optional IPA recirculation for more robust particle performance
Low cost of ownership
Drying based on surface tension gradient forces is an ultra-clean drying process. In this technique a volatile organic compound with lower surface tension than water is introduced in the vicinity of a substrate in the form of vapor as the wafer or the water is slowly withdrawn.
As the small quantity of alcohol vapor comes into contact with the continuously refreshed water meniscus, it absorbs in the water creating a surface tension gradient. The gradient causes the meniscus to partially contract and assume an apparent finite angle via a flow.
This causes the thin water film to flow off the substrate leaving it dry. This flow also removes nonvolatile contaminants and entrained particles.