RENA strives to be your partner in creating wet processing solutions. We have knowledgeable staff working on application-specific semiconductor processing solutions, including Metal Liftoff, Semiconductor Etch, Resist strip, Advanced Wet Etch, Gold Etch, and more. We are more than just Wet Benches. Contact us today for more information on your next Wet Processing solution.
Piranha etch is used to clean photoresist and other hard-to-remove organic residues from silicon wafers. For wafer cleaning, Piranha etch, is a mixture of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) Removal of gross organic materials from Si wafers, such as hardened photoresist polymer patterns after ion implantation, and other visible contaminants of organic nature, can be accomplished by using mixtures of H2SO4(98 wt%) and H2O2 (30 wt%). Volume ratios of 2:1-4:1 are used at a temperature of 100-130C. Organics are destroyed and eliminated by wet-chemical oxidation, but inorganic contamination, such as metals, are not absorbed. Many different mixture ratios are commonly used for Si wafer cleaning. A typical mixture is 3:1 concentrated sulfuric acid to 30% hydrogen peroxide solution; other protocols may use a 4:1 or even 7:1 mixture. RENA's Piranha solution offers exceptional process control with our proprietary IDX Flexware Process Control software, and complete wafer drying post clean, with our Genesis Marangoni drying system.
In Semiconductor and MEMs manufacturing, Gold Etch generally uses iodine-iodide, basic ferricyanide, aqua regia, or potassium cyanide. Each formulation displays its own strength and weaknesses and they all vary in speed, selectivity, stability, and safety. The iodine-iodide etch-ants are often regarded as a safe method of etching gold in terms of stability, toxicity, and overall handling. PVD Au Etch uniformity with Spray tools is terrible. Wafer centers have higher etch rates than edges, and incoming wafer roughness is amplified. The main general problem is that the wafers are spaced wide apart minimizing the uniformity problem, resulting in low throughput and inefficient chemical use. RENA has the solution for Plated Gold Etch (Plated Au Etch)
Using a proprietary patterned interface through a superior immersion wet processing system designed with integrated wafer rotation and precise micro bubble agitation results in a superior wetting process with increased uniformity of the layer patterns RENA's custom Gold Etch solution is offered in its production-ready, high-performance Revolution Wet Processing system. A multi-step, semi-automatic wet bench with custom-tailored processes and features. To include modeled flow mapping, integrated N2 agitation, proprietary re-circulation, and RENA's unique wafer rotation process that solves many uniformity issues found in other systems.
