MEI’s Advanced TruEtch Solution Achieves Top Results for Etch Uniformity

The TruEtch Solution - Exceptional Etch Uniformity in Compound Semiconductor


Proprietary process achieves superior Au, Ag, Cu and Ti etch performance,
delivering exceptional within wafer, wafer to wafer and batch to batch etch uniformity.

ALBANY, Ore., Sept. 2, 2014 — MEI Wet Processing Systems and Services revealed performance data today
on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

TruEtch achieves comparable etch uniformity, providing superior results when compared to single wafer spray tools for Cu and TiW Etch. Additionally, MEI’s critical etch solution enables consistent etching even within dense patterned areas. The superior immersion etch uniformity enables process engineers to minimize over etch times enabling the use of lower cost immersion technology to produce high end products. MEI’s critical etch system also saves valuable manufacturing floor space by reducing the wet process footprint requirement by at least 60% over comparable throughput single wafer spray tools.

“MEI’s TruEtch solution for Au, Ag, Cu and TiW will allow semiconductor manufacturers to lower costs, reclaim valuable cleanroom space and increase yield while producing high-quality results,” said Dan Cappello, President and CEO, MEI LLC. “Our immersion system etch uniformity far surpasses many alternative solutions. Side by side “split lot” comparison data demonstrates superior performance with <2% etch="" uniformity="" compared="" to="">15% for other immersion and spray tool designs.”


About MEI’s Critical Etch wet processing system—a new approach.

MEI’s advanced TruEtch Processing Tank is unlike conventional metal etch system. We leveraged our immersion experience to produce a low cost, small footprint, high-performance package. Our systems can be configured for single or combination metal etch steps over a wide variety of needs. Conventional etch solutions rely on a dry tool or complex deplating processes which are very expensive to operate. MEI’s immersion solution enables a new generation of mobile devices to be produced in a cost-effective manner. MEI’s batch immersion systems are field proven on 1-5 um features which were consistently etched with exceptional uniformity and high throughput. MEI’s TruEtch solution targets semiconductor and MEMS processing applications where metal pattern etches are required to create today's most sophisticated mobile communication devices.

 About MEI Wet Processing Systems and Services:

MEI Wet Processing Systems and Services LLC of Albany, Oregon, is a wet processing equipment and services company serving the semiconductor, MEMS, solar, and high technology industries. MEI Wet Processing has sales offices in the United States, Europe, China and Taiwan. MEI’s specialties include patented solutions for wet processing applications, automated and semi-automated wet benches, process systems and services; automated chemical delivery systems; and IDX Flexware process control software. MEI has a commitment to outstanding customer service.


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